Company News

(Apr '19) Mill-Max Presents New, Low Profile Solder Cup Headers

Friday, April 05, 2019

Low-Profile Solder Cup Headers


Low-Profile Solder Cup Headers
Low-Profile Solder Cup Headers
A space saving solution for wire to board applications

Mill-Max is proud to present a new, low profile solder cup header delivering a 25% reduction in height as compared to our current product.  These solder cup headers are ideal for making wire to board connections where keeping overall height to a minimum is essential.  The new 380-10-1XX-00-002000 (single row) & 480-10-2XX-00-002000 (double row) products feature a standoff height of .185 (4,7 mm), .100 (2,54 mm) pin spacing and .020 (,51 mm) diameter tails suitable for mating with a variety of sockets or terminating directly to a P.C.B.  The insulator material is Nylon 46 with an HDT of 290°C to withstand most soldering processes.  The solder cups are uniformly aligned to facilitate efficient soldering, especially useful for terminating cables, and can accept up to 22 AWG stranded wire.